Compatible Systems RISC 2800i Manual de usuario descargar pdf (Pagina 34)

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

34 Freescale Semiconductor

Package Description

8.6 Mechanical Dimensions for the MPC7448, 360 HCTE

RoHS-Compliant BGA

Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360

HCTE BGA package with RoHS-compliant lead-free spheres.

Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448,

360 HCTE RoHS-Compliant BGA Package

NOTES:

1. Dimensioning and

tolerancing per ASME

Y14.5M, 1994

2. Dimensions in millimeters.

3. Top side A1 corner index is a

metalized feature with

various shapes. Bottom side

A1 corner is designated with

a ball missing from the array.

4. Dimension A1 represents the

collapsed sphere diameter.

0.2

360X

A1 CORNER

0.2

12345678910111213141516

B0.3

0.15

0.15 A

171819

Millimeters

Dim Min Max

A 1.92 2.40

0.40 0.60

A2 0.70 0.90

A3 — 0.6

b 0.60 0.90

D 25.00 BSC

D1 — 11.3

D2 8.0 —

D3 — 6.5

D4 7.2 7.4

e 1.27 BSC

E 25.00 BSC

E1 — 11.3

E2 8.0 —

E3 — 6.5

E4 7.9 8.1

Capacitor Region

0.35 A

1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 59 60

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Compatible Systems RISC 2800i Manual de usuario Pagina 34

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