Compatible Systems RISC 2800i Manual de usuario Pagina 49

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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor 49
System Design Information
of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 25. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company 800-347-4572
18930 West 78
th
St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation 800-248-2481
Corporate Center
P.O. Box 994.
Midland, MI 48686-0994
Internet: www.dowcorning.com
0
0.5
1
1.5
2
0 1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific Thermal Resistance (K-in.
2
/W)
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