Compatible Systems RISC 2800i Manual de usuario Pagina 22

  • Descarga
  • Añadir a mis manuales
  • Imprimir
  • Pagina
    / 56
  • Tabla de contenidos
  • MARCADORES
  • Valorado. / 5. Basado en revisión del cliente
Vista de pagina 21
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
22 Freescale Semiconductor
Pin Assignments
6 Pin Assignments
Figure 12 (in Part A) shows the pinout of the MPC7447A, 360 high coefficient of thermal expansion
ceramic ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of
the HCTE package to indicate the direction of the top surface view.
Figure 12. Pinout of the MPC7447A, 360 HCTE Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
12 3 4 5678 910111213141516
Not to Scale
17 18 19
U
V
W
Part A
View
Part B
Die
Substrate Assembly
Encapsulant
Vista de pagina 21
1 2 ... 17 18 19 20 21 22 23 24 25 26 27 ... 55 56

Comentarios a estos manuales

Sin comentarios