
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor 31
Package Description
8.5 Package Parameters for the MPC7447A, 360 HCTE
RoHS-Compliant BGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360
lead-free high coefficient of thermal expansion ceramic ball grid array (HCTE).
Package outline 25 × 25 mm
Interconnects 360 (19 × 19 ball array – 1)
Pitch 1.27 mm (50 mil)
Minimum module height 2.32 mm
Maximum module height 2.80 mm
Ball diameter 0.75 mm (30 mil)
Coefficient of thermal expansion 12.3 ppm/°C
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