
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
44 Freescale Semiconductor
System Design Information
Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7447A. There are
several commercially-available heat sinks for the MPC7447A provided by the following vendors:
Aavid Thermalloy 603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech 408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions 401-732-8100
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics 717-564-0100
Chip Coolers™
P.O. Box 3608
Harrisburg, PA 17105-3608
Internet: www.chipcoolers.com
Wakefield Engineering 603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Thermal
Heat Sink
HCTE LGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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