Compatible Systems RISC 2800i Manual de usuario Pagina 32

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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
32 Freescale Semiconductor
Package Description
8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE
RoHS-Compliant BGA
Figure 15 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447A, 360
HCTE BGA package.
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447A,
360 HCTE RoHS-Compliant BGA Package
NOTES:
1. Dimensioning and
tolerancing per ASME
Y14.5M, 1994
2. Dimensions in millimeters.
3. Top side A1 corner index is a
metalized feature with
various shapes. Bottom side
A1 corner is designated with
a ball missing from the array.
4. Dimension A1 represents the
collapsed sphere diameter.
0.2
C
A
360X
D
2X
A1 CORNER
E
e
0.2
2X
C
B
12345678910111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B0.3
A
0.15
b
A
0.15 A
171819
U
W
V
Millimeters
Dim Min Max
A 2.32 2.80
A1
4
0.40 0.60
A2 1.10 1.30
A3 0.6
b 0.60 0.90
D 25.00 BSC
D1 11.3
D2 8.0
D3 6.5
D4 9.76 9.96
e 1.27 BSC
E 25.00 BSC
E1 11.3
E2 8.0
E3 6.5
E4 8.41 8.61
Capacitor Region
1
D3
E2
E1
A
A1
A2
A3
E4
D4
E3
D1
D2
0.35 A
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